Idézet
Thermal Design Power (TDP) is measured under the conditions of TCASE Max, IDD Max, and VDD=VID_VDD, and include all power dissipated on-die from VDD, VDDIO, VLDT, VTT, and VDDA.
Idézet
In order to gain a more thorough understanding of application power levels, Intel has estimated the power dissipation of a number of popular software applications. The method involved required extraction of actual code sequences from the programs and calculating the power consumed if that program were to be run on a Pentium 4 processor. Code sequences, or traces, were gathered from roughly 200 applications and benchmarks. These included Transaction Processing Performance Council TPC-C, SPEC*, SPECint* SPECfp, SPECweb, Ziff-Davis* 3Dwinbench* and Winstone*, Microsoft* desktop applications, id Software* Quake*, CorelDraw*, Video playback with Intel® MMX™ enhanced technology, several of which were run under multiple operating systems. (Including Microsoft Windows* 98, Microsoft Windows NT* and Linux*) and other compute intensive applications. See Figure 12 for a sample distribution of application power.
Processor power dissipation simulations indicate a maximum application power in the range of 75% of the maximum power for a given frequency. Therefore, a system designed to the thermal design point, which has been set to approximately 75% of the maximum processor power would be unlikely to see the thermal control circuit active and experience the associated performance reduction.
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Szerkesztette: special 2005. 04. 14. 10:21 -kor

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